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Sealing resin Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Sealing resin Product List

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Next-generation component performance improvement: high heat-resistant epoxy encapsulation resin.

Challenging even higher temperatures! Solving the improvement of component functionality with heat-resistant epoxy encapsulation resin.

It would be great to have a resin that maintains its performance unchanged even at high temperatures. This is the developed heat-resistant epoxy encapsulation resin created to solve that challenge. We would like to introduce our latest product lineup, which has undergone continuous improvements for power semiconductor modules, automotive devices, and components that require high heat resistance. *For more details, please download the PDF or feel free to contact us.

  • glue
  • Sealing resin

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Semiconductor encapsulation resin "Mold Laser Cleaner"

Semiconductor Encapsulation Resin Mold Dedicated "Mold Laser Cleaner"

Dedicated Semiconductor Encapsulation Resin "Mold Laser Cleaner IMT1200M" <<< Features >>> ■ No need to remove the mold (Insert the laser head into the mold) □ Removal of mold EMC contamination using laser ■ No need for melamine resin or rubber sheets □ High-speed mold cleaning (4 mold sets in under 30 minutes) ■ Reduction of downtime for mold equipment □ Low maintenance costs ■ No waste or odor after cleaning □ No danger to operators ■ Fully automated process □ No damage to the mold

  • Molding Equipment
  • Sealing resin

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Thermosetting resin Somatect KZ

Confident in various applications, as well as invasiveness and moisture resistance!

The Somatect KZ series is a thermosetting resin for semiconductor encapsulation. We offer a variety of applications, including grab-top resin, underfill resin, and CSP reinforcement resin.

  • Plastic utensils and containers
  • Sealing resin

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Bioglass for industrial equipment

Thermosetting materials that combine heat dissipation, dielectric strength, and adhesion properties.

In the field of high-power industrial equipment, the reliability and longevity of power modules are important challenges. In particular, with the increase in power output, there is a demand for both heat dissipation performance and insulation performance to be achieved simultaneously. "Biloglass" addresses these challenges by enabling uniform sealing down to fine details through high filling and low-pressure molding. This prevents performance degradation of the product and allows for stable operation. 【Usage Scenarios】 - High-power power modules - Inverters - Power supply units 【Benefits of Implementation】 - Improved heat dissipation - Ensured insulation - Extended product lifespan

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