Next-generation component performance improvement: high heat-resistant epoxy encapsulation resin.
Challenging even higher temperatures! Solving the improvement of component functionality with heat-resistant epoxy encapsulation resin.
It would be great to have a resin that maintains its performance unchanged even at high temperatures. This is the developed heat-resistant epoxy encapsulation resin created to solve that challenge. We would like to introduce our latest product lineup, which has undergone continuous improvements for power semiconductor modules, automotive devices, and components that require high heat resistance. *For more details, please download the PDF or feel free to contact us.
- 企業：ペルノックス
- 価格：Other
